40×40×11mm Gold Aluminium Heatsink with 100 Cooling Pins for Electronics

Passive Cooling Heatsink for Chipsets, FPGA Boards, MOSFET Transistors and COB LED Modules

This 40×40×11mm aluminium heatsink is designed for efficient passive cooling of electronic components, chipsets, integrated circuits and power semiconductor devices. Its large cooling surface and specialised design featuring 100 vertical cooling pins help dissipate heat and maintain suitable operating temperatures for electronic equipment.

Manufactured from high-quality extruded aluminium with good thermal conductivity, the heatsink features a 10×10 matrix of individual cooling pins. The open grid structure allows air to flow freely between the pins from multiple directions, making it suitable for natural convection as well as additional forced-air cooling using a fan.

The gold-coloured finish gives the heatsink an elegant appearance and helps protect the aluminium surface against oxidation and corrosion. Its compact 11mm height makes it suitable for installation in various electronic devices where mounting space is limited.

The bottom surface is flat and smooth. The heatsink is supplied without pre-applied thermal adhesive or double-sided thermal tape. This allows you to select the most appropriate mounting method for your application, including permanent thermal adhesive, double-sided thermal tape for easier removal, or thermal paste combined with mechanical fastening.

With its standard 40×40mm base, this model is suitable for cooling chipsets, processors, FPGA modules, stepper motor drivers, power components and other electronic devices.

Key Features:

• 40×40×11mm dimensions with a large cooling surface.

• 100 vertical cooling pins arranged in a 10×10 matrix.

• High-quality extruded aluminium construction.

• Gold-coloured finish.

• Open grid structure for airflow from multiple directions.

• Suitable for passive cooling and additional fan-assisted airflow.

• Smooth and flat mounting base.

• Supplied without pre-applied adhesive or thermal tape.

• Multiple mounting options depending on the application.

Suitable Applications:

• Motherboards – chipset and integrated circuit cooling.

• Northbridge and Southbridge chipsets.

• FPGA development boards and mini computers.

• Power MOSFET transistors and voltage regulators.

• Stepper motor drivers.

• Thermoelectric modules (TEC/Peltier), subject to the thermal load.

• Routers, network switches and communication equipment.

• High-power COB LED modules and electronic lighting systems.

• Various electronics and DIY projects.

Technical Specifications:

• Type: Passive Aluminium Heatsink

• Length: 40mm

• Width: 40mm

• Height: 11mm

• Material: Extruded Aluminium

• Colour: Gold

• Finish: Gold-coloured

• Design: Open grid matrix of vertical cooling pins

• Pin Arrangement: 10×10

• Total Number of Cooling Pins: 100

• Cooling Method: Passive, natural air convection

• Additional Cooling: Suitable for fan-assisted airflow

• Mounting Surface: Smooth and flat

• Thermal Adhesive: Not included

• Double-Sided Thermal Tape: Not included

• Installation: Thermal adhesive, thermal tape or thermal paste with mechanical fasteners

Note: The heatsink is supplied without thermal paste, thermal adhesive or double-sided thermal tape. These must be purchased separately. Actual cooling performance depends on heat output, thermal contact quality and airflow. When cooling COB LEDs or TEC/Peltier modules, the specific power rating and thermal load must be taken into account. The 40×40mm dimensions alone do not guarantee compatibility with every factory mounting clip.