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TSP Thermal Compound – Effective Heat Dissipation for CPUs, GPUs and Electronic Modules

TSP Silicone Thermal Paste, 10g – for CPUs, Electronics and Heat Transfer Applications
TSP Thermal Compound – Effective Heat Dissipation for CPUs, GPUs and Electronic Modules
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€1.90
Price in reward points: 190
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  • Stock: 124
  • Brand: NN Electronic
  • Reward Points: 10
  • Model: TSP 10g
  • Weight: 0.02kg
  • EAN: 3800203800189

High-Quality Silicone Thermal Paste for Reducing Thermal Resistance and Long-Term Reliability

TSP silicone thermal paste (10g) is designed to improve heat transfer between heat-generating electronic components and cooling heatsinks. It ensures reliable thermal contact by filling microscopic gaps between surfaces and reducing thermal resistance.

It is suitable for CPUs, GPUs, chips, transistors, power components, and other electronic modules requiring efficient cooling. Thanks to its silicone-based formulation, it maintains stable properties under varying temperature conditions and provides long-lasting performance.

The product is suitable for both professional servicing and home maintenance of computer and electronic equipment.

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