GD900 Thermal Paste 30 Grams – High-Performance Thermal Grease for Processors and Chips

Technical Specifications and Application of GD900 Thermal Paste (4.8 W/m·K, 30g)

The GD900 thermal conductive grease paste is a high-quality thermal interface material (TIM) designed to enhance heat transfer between electronic components (like CPUs, GPUs, chips, LED modules) and their heatsinks or coolers. It fills microscopic air gaps between surfaces to improve cooling performance and help maintain stable operating temperatures.

Key Features:
✔ Type: thermally conductive grease for interface use between heat sources and sinks.
✔ Material: silicone-based compound with metal/oxide fillers for improved conductivity.
✔ Thermal Conductivity: about 4.8 W/m·K or more (depending on batch).
✔ Operating Temp.: wide range (approx. -50 °C to 200 °C) – suitable for many applications.
✔ Consistency: smooth paste for easy application.
✔ Color: gray/charcoal.
✔ Package: typically supplied in a 30 g syringe with applicator (also available in 1 g).

Function:
The paste acts as a thermal bridge between a heat-producing component and its heatsink. By filling tiny gaps that would otherwise trap air (a poor conductor), it improves heat dissipation and helps keep electronic components cooler during operation.

Applications:
✔ Cooling CPU and GPU in desktops, laptops, and gaming rigs.
✔ LED modules and other high-heat-output electronics.
✔ Power MOSFETs, ASIC boards, and semiconductor devices requiring thermal maintenance.
✔ Repair and maintenance of PCBs and cooling systems.

Advantages:

• Improved heat transfer for better cooling performance.

• Easy to apply and spread evenly across contact surfaces.

• Versatile use across electronic systems.

• Stable under wide temperature ranges.