This offer ends in:
- Stock: 3
- Brand: OEM
- Reward Points: 16
- Model: 6310
- Warranty: няма
The RGeek 6.0 W/mK Thermal Pad is a high-performance thermal interface material made from thermally conductive silicone, designed for effective heat transfer between heat-generating chips (such as CPUs, GPUs, VRMs/MOSFETs) and their heatsinks. This pad fills microscopic air gaps between surfaces to enhance heat conduction and improve cooling efficiency.
Key Features:
✔ Dimensions: 100 × 100 × 2 mm – ideal for larger chips and interfaces;
✔ Thermal Conductivity: 6.0 W/mK – high heat transfer capability;
✔ Material: thermally conductive silicone – flexible and easy to install;
✔ Installation: cut to desired size and place between heatsink and component;
Benefits:
✔ Helps optimize cooling performance, lowering operational temperatures of key components;
✔ Fills surface irregularities better than traditional methods;
✔ Clean and maintenance-friendly compared to thermal pastes;
✔ Suitable for use in PCs, laptops, industrial electronics and DIY cooling solutions.
Applications:
✔ Thermal management for CPU and GPU cooling systems
✔ Thermal gap bridging in heatsinks and cooling modules
✔ Enhanced heat dissipation in electronics and hardware projects
✔ Replacement for worn or ineffective thermal pads
- Доставка до адрес: €5.00
- Доставка до офис на Еконт: €4.50
- Доставка до офис на Спиди: €3.50
- Доставка до автомат на Спиди: €2.50
- Доставка до BOXNOW: €2.00
- За фиксиран час се добавя €2.00
- Безплатна доставка при поръчка над €100.00
Всички поръчки се изпращат с застраховка и преглед. Моля при получаването на продукта да го прегледате пред куриера за евентуални наранявания при превоза.
Стоката се изпраща до 2 работни дни след направената поръчка. Имате право да върнете стоката в 14 дневен период, като цената на доставката при връщането е за ваша сметка.
